銲料 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "銲料" in Chinese language version.

refsWebsite

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12books.google.com

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2web.archive.org

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books.google.com

Madhav Datta, Tetsuya Ōsaka, Joachim Walter Schultze. Microelectronic packaging. CRC Press. 2005: 196. ISBN 0-415-31190-X.
Joseph R. Davis. Alloying: understanding the basics. ASM International. 2001: 538. ISBN 0-87170-744-6.
Howard H. Manko. Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. 2001: 164. ISBN 0-07-134417-9.
A. C. Tan. Lead finishing in semiconductor devices: soldering. World Scientific. 1989: 45. ISBN 9971-5-0679-3.
Karl J. Puttlitz, Kathleen A. Stalter. Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. 2004: 541. ISBN 0-8247-4870-0.
Merrill L. Minges. Electronic Materials Handbook: Packaging. ASM International. 1989: 239. ISBN 0-87170-285-1.
Walter Heinrich Kohl. Handbook of materials and techniques for vacuum devices. Springer. 1995: 51. ISBN 978-1-56396-387-2.
Brian Caddy. Forensic examination of glass and paint: analysis and interpretation. CRC Press. 2001: 40. ISBN 0-7484-0579-8.
Robert W. Messler. Joining of materials and structures: from pragmatic process to enabling technology. Butterworth-Heinemann. 2004: 389. ISBN 0-7506-7757-0.
Alexander Roth. Vacuum sealing techniques. Springer. 1994: 273. ISBN 1563962594.
Heinz G. Pfaender. Schott guide to glass. Springer. 1996: 30. ISBN 0-412-62060-X.
Friedrich Beck. Integrated circuit failure analysis: a guide to preparation techniques. John Wiley and Sons. 1998: 8. ISBN 0-471-97401-3.

doi.org

Needleman, HL; Schell, A; Bellinger, D; Leviton, A; Allred, EN. The long-term effects of exposure to low doses of lead in childhood. An 11-year follow-up report.. The New England Journal of Medicine. 1990, 322 (2): 83–8. PMID 2294437. doi:10.1056/NEJM199001113220203.

google.com.tw

books.google.com.tw

The Encyclopedia of Jewelry-making Techniques. 1995: 112 [2015-08-08]. ISBN 1-56138-526-3. （原始内容存档于2016-04-01）.

nih.gov

ncbi.nlm.nih.gov

Needleman, HL; Schell, A; Bellinger, D; Leviton, A; Allred, EN. The long-term effects of exposure to low doses of lead in childhood. An 11-year follow-up report.. The New England Journal of Medicine. 1990, 322 (2): 83–8. PMID 2294437. doi:10.1056/NEJM199001113220203.

tdk.com

product.tdk.com

存档副本. [2015-10-14]. （原始内容存档于2015-10-14）.

web.archive.org

存档副本. [2015-10-14]. （原始内容存档于2015-10-14）.
The Encyclopedia of Jewelry-making Techniques. 1995: 112 [2015-08-08]. ISBN 1-56138-526-3. （原始内容存档于2016-04-01）.