Electroplating (English Wikipedia)

A.C. Tan (30 November 1992). Tin and Solder Plating in the Semiconductor Industry. Springer Science & Business Media. p. 122. ISBN 978-0-412-48240-3. Archived from the original on 1 August 2020. Retrieved 16 May 2019.
Todd, Robert H.; Allen, Dell K.; Alting, Leo (1994). "Surface Coating". Manufacturing Processes Reference Guide. Industrial Press. pp. 454–458. ISBN 0-8311-3049-0. Archived from the original on 2013-10-09.

doi.org (Global: 2^nd place; English: 2^nd place)

Farber, H. L. (1930). "Throwing Power in Chromium Plating" (PDF). Bureau of Standards Journal of Research. 3: 27. doi:10.6028/jres.004.003. Retrieved 6 August 2023.
Hunt, L. B. (March 1973). "The early history of gold plating". Gold Bulletin. 6 (1): 16–27. doi:10.1007/BF03215178.
Stelter, M.; Bombach, H. (2004). "Process Optimization in Copper Electrorefining". Advanced Engineering Materials. 6 (7): 558. doi:10.1002/adem.200400403. S2CID 138550311.
kunji durai, M. S.; chaala, Mathy (2008). "Pulse and pulse reverse plating—Conceptual, advantages and applications". Electrochimica Acta. 53 (8): 3313–3322. doi:10.1016/j.electacta.2007.11.054.
McCormick, M.; Kuhn, A. T. (1993). "The Haring-Blum Cell". Transactions of the IMF. 71 (2): 74–76. doi:10.1080/00202967.1993.11870992. ISSN 0020-2967.
Gabe, David R. (2002). "Test cells for plating". Metal Finishing. 100: 579–586. doi:10.1016/s0026-0576(02)82059-1. ISSN 0026-0576.
Bard, Allan; Inzelt, György; Scholz, Fritz (2012). "Haring–Blum Cell". Electrochemical Dictionary. Springer. p. 444. doi:10.1007/978-3-642-29551-5_8. ISBN 978-3-642-29551-5.

Farber, H. L. (1930). "Throwing Power in Chromium Plating" (PDF). Bureau of Standards Journal of Research. 3: 27. doi:10.6028/jres.004.003. Retrieved 6 August 2023.

Stelter, M.; Bombach, H. (2004). "Process Optimization in Copper Electrorefining". Advanced Engineering Materials. 6 (7): 558. doi:10.1002/adem.200400403. S2CID 138550311.

"Debunking the So-Called "Baghdad Battery"". Tales of Times Forgotten. 2020-03-08. Retrieved 2021-10-10.

"FAQs | Frequently Asked Questions | Electropolishing || Electro-Glo". Archived from the original on 2020-11-28. Retrieved 2019-05-01.
"Pollution Prevention Technology Profile Trivalent Chromium Replacements for Hexavalent Chromium Plating" (PDF). Northeast Waste Management Officials’ Association. 2003-10-18. Archived from the original (PDF) on 2011-07-20.
"The history of galvanotechnology in Russia" (in Russian). Archived from the original on March 5, 2012.
A.C. Tan (30 November 1992). Tin and Solder Plating in the Semiconductor Industry. Springer Science & Business Media. p. 122. ISBN 978-0-412-48240-3. Archived from the original on 1 August 2020. Retrieved 16 May 2019.
Kushner, Arthur S. (December 1, 2006). "Hull Cell 101". Products Finishing. Archived from the original on March 13, 2010.
Todd, Robert H.; Allen, Dell K.; Alting, Leo (1994). "Surface Coating". Manufacturing Processes Reference Guide. Industrial Press. pp. 454–458. ISBN 0-8311-3049-0. Archived from the original on 2013-10-09.

McCormick, M.; Kuhn, A. T. (1993). "The Haring-Blum Cell". Transactions of the IMF. 71 (2): 74–76. doi:10.1080/00202967.1993.11870992. ISSN 0020-2967.
Gabe, David R. (2002). "Test cells for plating". Metal Finishing. 100: 579–586. doi:10.1016/s0026-0576(02)82059-1. ISSN 0026-0576.