Photolithography (English Wikipedia)

Switkes, M.; Rothschild, M. (2001). "Immersion lithography at 157 nm". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena. 19 (6): 2353–2356. Bibcode:2001JVSTB..19.2353S. doi:10.1116/1.1412895.

anandtech.com

"TSMC Kicks Off Volume Production of 7nm Chips". AnandTech. 2018-04-28. Retrieved 2018-10-20.

archive.org

Weightman, Gavin (2015). Eureka: How Invention Happens. Yale University Press. pp. 178–179. ISBN 978-0300192087.

asu.edu

cores.research.asu.edu

"Techniques - lithography | Core Facilities". cores.research.asu.edu. Retrieved 2020-02-04.

books.google.com

Levinson, Harry J. (2005). Principles of Lithography. SPIE Press. ISBN 9780819456601.
Handbook of Integrated Circuit Industry. Springer. 27 November 2023. ISBN 978-981-99-2836-1.
Handbook of VLSI Microlithography, 2nd Edition. Cambridge University Press. April 2001. ISBN 9780080946801.
Proceedings of the Seventh Symposium on Automated Integrated Circuits Manufacturing. The Electrochemical Society. 1992. ISBN 9781566770040.
Handbook of Integrated Circuit Industry. Springer. 27 November 2023. ISBN 978-981-99-2836-1.
Wang, Yangyuan; Chi, Min-Hwa; Lou, Jesse Jen-Chung; Chen, Chun-Zhang (November 27, 2023). Handbook of Integrated Circuit Industry. Springer Nature. ISBN 978-981-99-2836-1 – via Google Books.
Microlithography: Science and Technology, Second Edition. CRC Press. 3 October 2018. ISBN 9781420051537.
Wei, Yayi; Brainard, Robert L. (January 1, 2009). Advanced Processes for 193-nm Immersion Lithography. SPIE Press. ISBN 978-0-8194-7557-2 – via Google Books.
Advanced Processes for 193-nm Immersion Lithography. SPIE Press. 2009. ISBN 9780819475572.

caltech.edu

authors.library.caltech.edu

Zhao, X-A; Kolawa, E; Nicolet, M-A (1986). "Reactions of thin metal films with crystalline and amorphous Al2O3". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 4 (6): 3139. Bibcode:1986JVSTA...4.3139Z. doi:10.1116/1.573642.

cea.fr

https://www.cea.fr/cea-tech/leti/english/Documents/Spie-Litho/03%20-%20ML2%20-%20MAPPER%20-%20M%20Wieland%20-%20LETI%20WS%20SPIE%202018.pdf ^{[bare URL PDF]}

chiphistory.org

"Canon PLA 501F/FA Proximity Aligner".
"GCA Mann 4800 Direct Step on Wafer". Chip History. Retrieved 2023-12-30.
"Perkin-Elmer Series 100 Projection Scanning Aligners".
"Maskless Lithography: A recurring dream".

computerhistory.org

"Jay W. Lathrop | Computer History Museum". www.computerhistory.org. Retrieved 2018-06-18.

design-reuse.com

"MAPPER and TSMC Take Next Step in Exploring Multiple E-beam Lithography for IC Manufacturing at 22 nanometer node and Beyond".

doi.org

Carroll, Gregory T.; Turro, Nicholas J.; Mammana, Angela; Koberstein, Jeffrey T. (2017). "Photochemical Immobilization of Polymers on a Surface: Controlling Film Thickness and Wettability". Photochemistry and Photobiology. 93 (5): 1165–1169. doi:10.1111/php.12751. ISSN 0031-8655. PMID 28295380. S2CID 32105803.
Willson, C. G., Dammel, R. R., and Reiser, A (1997). Tarascon-Auriol, Regine G (ed.). "Photoresist materials: a historical perspective". Advances in Resist Technology and Processing XIV. 3049: 28. Bibcode:1997SPIE.3049...28W. doi:10.1117/12.275826. S2CID 136616549.{{cite journal}}: CS1 maint: multiple names: authors list (link)
Lathrop, Jay W. (2013). "The Diamond Ordnance Fuze Laboratory's Photolithographic Approach to Microcircuits - IEEE Journals & Magazine". IEEE Annals of the History of Computing. 35: 48–55. doi:10.1109/MAHC.2011.83. S2CID 2562671.
Clark, Benjamin L.; Kocsis, Michael; Greer, Michael; Grenville, Andrew; Saito, Takashi; Huli, Lior; Farrell, Richard; Hetzer, David; Hu, Shan; Matsumoto, Hiroie; Metz, Andrew; Kawakami, Shinchiro; Matsunaga, Koichi; Enomoto, Masashi; Lauerhaas, Jeffrey; Ratkovich, Anthony; Dekraker, David (2015). "Coater/Developer process integration of metal-oxide based photoresist". In Wallow, Thomas I.; Hohle, Christoph K. (eds.). Advances in Patterning Materials and Processes XXXII. Vol. 9425. pp. 355–361. doi:10.1117/12.2085982. S2CID 122169514.
Zhao, X-A; Kolawa, E; Nicolet, M-A (1986). "Reactions of thin metal films with crystalline and amorphous Al2O3". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 4 (6): 3139. Bibcode:1986JVSTA...4.3139Z. doi:10.1116/1.573642.
Jamieson, Andrew; Dam, Thuc; Baik, Ki-Ho; Duerksen, Ken; Eidson, Elie; Akai, Keiji; Hisano, Kazuya; Kohama, Norifumi; Machidori, Shinichi (May 20, 2006). "The design and qualification of the TEL CLEAN TRACK ACT^TMM photomask coating tool at Intel". In Hoga, Morihisa (ed.). Photomask and Next-Generation Lithography Mask Technology XIII. Vol. 6283. SPIE. pp. 471–478. doi:10.1117/12.681751. S2CID 110358910 – via www.spiedigitallibrary.org.
"S. Arscott, 'The limits of edge bead planarization and surface levelling in spin-coated liquid films', J. Micromech. Microeng. 30, 025003, (2020)". doi:10.1088/1361-6439/ab60be. hdl:20.500.12210/44092. S2CID 214580612. {{cite journal}}: Cite journal requires |journal= (help)
Reiter, Tamas; McCann, Michael; Connolly, James; Haughey, Sean (2022). "An Investigation of Edge Bead Removal Width Variability, Effects and Process Control in Photolithographic Manufacturing". IEEE Transactions on Semiconductor Manufacturing. 35: 60–66. doi:10.1109/TSM.2021.3129770. S2CID 244560651.
Wei, Yayi; Brainard, Robert (February 19, 2009). "Process Steps in the Track". Advanced Processes for 193-nm Immersion Lithography. Vol. PM189. pp. 19–52. doi:10.1117/3.820233.ch2. ISBN 978-0-8194-7557-2 – via www.spiedigitallibrary.org.
Hiroi, Yoshiomi; Kishioka, Takahiro; Sakamoto, Rikimaru; Maruyama, Daisuke; Ohashi, Takuya; Ishida, Tomohisa; Kimura, Shigeo; Sakaida, Yasushi; Watanabe, Hisayuki (2007). "BARC (Bottom anti-reflective coating) for immersion process". In Lin, Qinghuang (ed.). Advances in Resist Materials and Processing Technology XXIV. Vol. 6519. pp. 731–740. doi:10.1117/12.711305. S2CID 122377285.
Wakamizu, Shinya; Kyouda, Hideharu; Nakano, Katsushi; Fujiwara, Tomoharu (2008). "193-nm immersion lithography for high volume manufacturing using novel immersion exposure tool and coater/Developer system". In Chen, Alek C.; Lin, Burn; Yen, Anthony (eds.). Lithography Asia 2008. Vol. 7140. pp. 819–826. doi:10.1117/12.804675. S2CID 109584069.
Wang, Han; Ning, Feng; Xu, Qiang; Liu, Xue-Ping (2015). "A summary of the current development of developing technology in the field of integrated circuit manufacturing". Proceedings of the 3rd International Conference on Mechatronics, Robotics and Automation. Vol. 15. doi:10.2991/ICMRA-15.2015.256. ISBN 978-94-62520-76-9. S2CID 54991701.
Fujiwara, Tomoharu; Shiraishi, Kenichi; Tanizaki, Hirokazu; Ishii, Yuuki; Kyoda, Hideharu; Yamamoto, Taro; Ishida, Seiki (2006). "Wafer management between coat/Developer track and immersion lithography tool". In Flagello, Donis G. (ed.). Optical Microlithography XIX. Vol. 6154. pp. 1553–1562. doi:10.1117/12.656303. S2CID 110508653.
Noh, Jinsoo; Jung, Minhoon; Jung, Younsu; Yeom, Chisun; Pyo, Myoungho; Cho, Gyoujin (April 2015). "Key Issues With Printed Flexible Thin Film Transistors and Their Application in Disposable RF Sensors". Proceedings of the IEEE. 103 (4): 554–566. doi:10.1109/JPROC.2015.2410303. ISSN 0018-9219.
Ma, J. H.; Naulleau, P.; Ahmed, M.; Kostko, O. (2020). "Determination of effective attenuation length of slow electrons in polymer films". Journal of Applied Physics. 127 (24): 245301. Bibcode:2020JAP...127x5301M. doi:10.1063/5.0007163. OSTI 1782149. S2CID 221935438.
Itani, Toshiro; Wakamiya, Wataru; Cashmore, Julian; Gower, Malcolm (2003). "157-nm lithography with high numerical aperture lens for sub-70 nm node". Microelectronic Engineering. 67–68: 39–46. doi:10.1016/S0167-9317(03)00057-1.
Switkes, M.; Rothschild, M. (2001). "Immersion lithography at 157 nm". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena. 19 (6): 2353–2356. Bibcode:2001JVSTB..19.2353S. doi:10.1116/1.1412895.
Jonušauskas, Linas; Gailevičius, Darius; Mikoliūnaitė, Lina; Sakalauskas, Danas; Šakirzanovas, Simas; Juodkazis, Saulius; Malinauskas, Mangirdas (2017-01-02). "Optically Clear and Resilient Free-Form μ-Optics 3D-Printed via Ultrafast Laser Lithography". Materials. 10 (1): 12. Bibcode:2017Mate...10...12J. doi:10.3390/ma10010012. PMC 5344581. PMID 28772389.
Pfeiffer, Hans C. (2010). Montgomery, M. Warren; Maurer, Wilhelm (eds.). "Direct write electron beam lithography: A historical overview". Photomask Technology 2010. 7823. Bibcode:2010SPIE.7823E..16P. doi:10.1117/12.868477. S2CID 108646584.

eetimes.com

"Leti receives Mapper 300-mm e-beam lithography platform". 21 July 2009.

escholarship.org

Ma, J. H.; Naulleau, P.; Ahmed, M.; Kostko, O. (2020). "Determination of effective attenuation length of slow electrons in polymer films". Journal of Applied Physics. 127 (24): 245301. Bibcode:2020JAP...127x5301M. doi:10.1063/5.0007163. OSTI 1782149. S2CID 221935438.

handle.net

hdl.handle.net

"S. Arscott, 'The limits of edge bead planarization and surface levelling in spin-coated liquid films', J. Micromech. Microeng. 30, 025003, (2020)". doi:10.1088/1361-6439/ab60be. hdl:20.500.12210/44092. S2CID 214580612. {{cite journal}}: Cite journal requires |journal= (help)

harvard.edu

ui.adsabs.harvard.edu

Willson, C. G., Dammel, R. R., and Reiser, A (1997). Tarascon-Auriol, Regine G (ed.). "Photoresist materials: a historical perspective". Advances in Resist Technology and Processing XIV. 3049: 28. Bibcode:1997SPIE.3049...28W. doi:10.1117/12.275826. S2CID 136616549.{{cite journal}}: CS1 maint: multiple names: authors list (link)
Zhao, X-A; Kolawa, E; Nicolet, M-A (1986). "Reactions of thin metal films with crystalline and amorphous Al2O3". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 4 (6): 3139. Bibcode:1986JVSTA...4.3139Z. doi:10.1116/1.573642.
Ma, J. H.; Naulleau, P.; Ahmed, M.; Kostko, O. (2020). "Determination of effective attenuation length of slow electrons in polymer films". Journal of Applied Physics. 127 (24): 245301. Bibcode:2020JAP...127x5301M. doi:10.1063/5.0007163. OSTI 1782149. S2CID 221935438.
Switkes, M.; Rothschild, M. (2001). "Immersion lithography at 157 nm". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena. 19 (6): 2353–2356. Bibcode:2001JVSTB..19.2353S. doi:10.1116/1.1412895.
Jonušauskas, Linas; Gailevičius, Darius; Mikoliūnaitė, Lina; Sakalauskas, Danas; Šakirzanovas, Simas; Juodkazis, Saulius; Malinauskas, Mangirdas (2017-01-02). "Optically Clear and Resilient Free-Form μ-Optics 3D-Printed via Ultrafast Laser Lithography". Materials. 10 (1): 12. Bibcode:2017Mate...10...12J. doi:10.3390/ma10010012. PMC 5344581. PMID 28772389.
Pfeiffer, Hans C. (2010). Montgomery, M. Warren; Maurer, Wilhelm (eds.). "Direct write electron beam lithography: A historical overview". Photomask Technology 2010. 7823. Bibcode:2010SPIE.7823E..16P. doi:10.1117/12.868477. S2CID 108646584.

ieee.org

ieeexplore.ieee.org

Reiter, Tamas; McCann, Michael; Connolly, James; Haughey, Sean (2022). "An Investigation of Edge Bead Removal Width Variability, Effects and Process Control in Photolithographic Manufacturing". IEEE Transactions on Semiconductor Manufacturing. 35: 60–66. doi:10.1109/TSM.2021.3129770. S2CID 244560651.
Jain, K. et al., "Ultrafast deep-UV lithography with excimer lasers", IEEE Electron Device Lett., Vol. EDL-3, 53 (1982): https://ieeexplore.ieee.org/document/1482581/;jsessionid=66FBB98827D6C47335DB6E9D31D6000E?arnumber=1482581
"MAPPER: High Throughput Maskless Lithography". January 2009. pp. 1–5.

iop.org

iopscience.iop.org

"S. Arscott, 'The limits of edge bead planarization and surface levelling in spin-coated liquid films', J. Micromech. Microeng. 30, 025003, (2020)". doi:10.1088/1361-6439/ab60be. hdl:20.500.12210/44092. S2CID 214580612. {{cite journal}}: Cite journal requires |journal= (help)

jst.go.jp

jstage.jst.go.jp

Nalamasu, Omkaram; et al. "An Overview of Resist Processing for DUV Photolithography".

laserfest.org

American Physical Society / Lasers / History / Timeline; http://www.laserfest.org/lasers/history/timeline.cfm

laserfocusworld.com

"MICROELECTRONICS PROCESSING - Lithography at 157 nm gains momentum". August 1999.
"StackPath". 29 August 2019.

lbl.gov

euvlsymposium.lbl.gov

"Resolution, LER, and Sensitivity Limitations of Photoresist" (PDF).

linkedin.com

lithoguru.com

"Semiconductor Lithography (Photolithography) - The Basic Process".

lyondellbasell.com

"AN-Methyl-2-Pyrrolidone" (PDF).

martini-tech.com

Martini, Matteo. "Light Sources Used in Photolithography". Archived from the original on 2014-10-29. Retrieved 2014-10-28.

maximizemarketresearch.com

"Photolithography Market: Global Industry Analysis and Forecast (2021-2029)". MAXIMIZE MARKET RESEARCH. Retrieved 2023-03-14.

nih.gov

pubmed.ncbi.nlm.nih.gov

Carroll, Gregory T.; Turro, Nicholas J.; Mammana, Angela; Koberstein, Jeffrey T. (2017). "Photochemical Immobilization of Polymers on a Surface: Controlling Film Thickness and Wettability". Photochemistry and Photobiology. 93 (5): 1165–1169. doi:10.1111/php.12751. ISSN 0031-8655. PMID 28295380. S2CID 32105803.
Jonušauskas, Linas; Gailevičius, Darius; Mikoliūnaitė, Lina; Sakalauskas, Danas; Šakirzanovas, Simas; Juodkazis, Saulius; Malinauskas, Mangirdas (2017-01-02). "Optically Clear and Resilient Free-Form μ-Optics 3D-Printed via Ultrafast Laser Lithography". Materials. 10 (1): 12. Bibcode:2017Mate...10...12J. doi:10.3390/ma10010012. PMC 5344581. PMID 28772389.

ncbi.nlm.nih.gov

Jonušauskas, Linas; Gailevičius, Darius; Mikoliūnaitė, Lina; Sakalauskas, Danas; Šakirzanovas, Simas; Juodkazis, Saulius; Malinauskas, Mangirdas (2017-01-02). "Optically Clear and Resilient Free-Form μ-Optics 3D-Printed via Ultrafast Laser Lithography". Materials. 10 (1): 12. Bibcode:2017Mate...10...12J. doi:10.3390/ma10010012. PMC 5344581. PMID 28772389.

nist.gov

nvlpubs.nist.gov

"Office of microelectronics programs: programs, activities, and accomplishments" (PDF). National Bureau of Standards: Electronics and Electrical Engineering Laboratory. Archived (PDF) from the original on July 23, 2020. Retrieved June 20, 2022. Alt URL

osti.gov

Ma, J. H.; Naulleau, P.; Ahmed, M.; Kostko, O. (2020). "Determination of effective attenuation length of slow electrons in polymer films". Journal of Applied Physics. 127 (24): 245301. Bibcode:2020JAP...127x5301M. doi:10.1063/5.0007163. OSTI 1782149. S2CID 221935438.

patents.google.com

US3122817A, Jules, Andrus, "Fabrication of semiconductor devices", issued 1964-03-03

pulsenews.co.kr

m.pulsenews.co.kr

"Samsung Elec becomes world's 1st to use EUV at 7nm process - Pulse by Maeil Business News Korea".

reed-electronics.com

Hand, Aaron. "High-Index Lenses Push Immersion Beyond 32 nm". Archived from the original on 2015-09-29.

samsung.com

news.samsung.com

"Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology". October 17, 2016.

sciencedirect.com

Itani, Toshiro; Wakamiya, Wataru; Cashmore, Julian; Gower, Malcolm (2003). "157-nm lithography with high numerical aperture lens for sub-70 nm node". Microelectronic Engineering. 67–68: 39–46. doi:10.1016/S0167-9317(03)00057-1.

semanticscholar.org

api.semanticscholar.org

Carroll, Gregory T.; Turro, Nicholas J.; Mammana, Angela; Koberstein, Jeffrey T. (2017). "Photochemical Immobilization of Polymers on a Surface: Controlling Film Thickness and Wettability". Photochemistry and Photobiology. 93 (5): 1165–1169. doi:10.1111/php.12751. ISSN 0031-8655. PMID 28295380. S2CID 32105803.
Willson, C. G., Dammel, R. R., and Reiser, A (1997). Tarascon-Auriol, Regine G (ed.). "Photoresist materials: a historical perspective". Advances in Resist Technology and Processing XIV. 3049: 28. Bibcode:1997SPIE.3049...28W. doi:10.1117/12.275826. S2CID 136616549.{{cite journal}}: CS1 maint: multiple names: authors list (link)
Lathrop, Jay W. (2013). "The Diamond Ordnance Fuze Laboratory's Photolithographic Approach to Microcircuits - IEEE Journals & Magazine". IEEE Annals of the History of Computing. 35: 48–55. doi:10.1109/MAHC.2011.83. S2CID 2562671.
Clark, Benjamin L.; Kocsis, Michael; Greer, Michael; Grenville, Andrew; Saito, Takashi; Huli, Lior; Farrell, Richard; Hetzer, David; Hu, Shan; Matsumoto, Hiroie; Metz, Andrew; Kawakami, Shinchiro; Matsunaga, Koichi; Enomoto, Masashi; Lauerhaas, Jeffrey; Ratkovich, Anthony; Dekraker, David (2015). "Coater/Developer process integration of metal-oxide based photoresist". In Wallow, Thomas I.; Hohle, Christoph K. (eds.). Advances in Patterning Materials and Processes XXXII. Vol. 9425. pp. 355–361. doi:10.1117/12.2085982. S2CID 122169514.
Jamieson, Andrew; Dam, Thuc; Baik, Ki-Ho; Duerksen, Ken; Eidson, Elie; Akai, Keiji; Hisano, Kazuya; Kohama, Norifumi; Machidori, Shinichi (May 20, 2006). "The design and qualification of the TEL CLEAN TRACK ACT^TMM photomask coating tool at Intel". In Hoga, Morihisa (ed.). Photomask and Next-Generation Lithography Mask Technology XIII. Vol. 6283. SPIE. pp. 471–478. doi:10.1117/12.681751. S2CID 110358910 – via www.spiedigitallibrary.org.
"S. Arscott, 'The limits of edge bead planarization and surface levelling in spin-coated liquid films', J. Micromech. Microeng. 30, 025003, (2020)". doi:10.1088/1361-6439/ab60be. hdl:20.500.12210/44092. S2CID 214580612. {{cite journal}}: Cite journal requires |journal= (help)
Reiter, Tamas; McCann, Michael; Connolly, James; Haughey, Sean (2022). "An Investigation of Edge Bead Removal Width Variability, Effects and Process Control in Photolithographic Manufacturing". IEEE Transactions on Semiconductor Manufacturing. 35: 60–66. doi:10.1109/TSM.2021.3129770. S2CID 244560651.
Hiroi, Yoshiomi; Kishioka, Takahiro; Sakamoto, Rikimaru; Maruyama, Daisuke; Ohashi, Takuya; Ishida, Tomohisa; Kimura, Shigeo; Sakaida, Yasushi; Watanabe, Hisayuki (2007). "BARC (Bottom anti-reflective coating) for immersion process". In Lin, Qinghuang (ed.). Advances in Resist Materials and Processing Technology XXIV. Vol. 6519. pp. 731–740. doi:10.1117/12.711305. S2CID 122377285.
Wakamizu, Shinya; Kyouda, Hideharu; Nakano, Katsushi; Fujiwara, Tomoharu (2008). "193-nm immersion lithography for high volume manufacturing using novel immersion exposure tool and coater/Developer system". In Chen, Alek C.; Lin, Burn; Yen, Anthony (eds.). Lithography Asia 2008. Vol. 7140. pp. 819–826. doi:10.1117/12.804675. S2CID 109584069.
Wang, Han; Ning, Feng; Xu, Qiang; Liu, Xue-Ping (2015). "A summary of the current development of developing technology in the field of integrated circuit manufacturing". Proceedings of the 3rd International Conference on Mechatronics, Robotics and Automation. Vol. 15. doi:10.2991/ICMRA-15.2015.256. ISBN 978-94-62520-76-9. S2CID 54991701.
Fujiwara, Tomoharu; Shiraishi, Kenichi; Tanizaki, Hirokazu; Ishii, Yuuki; Kyoda, Hideharu; Yamamoto, Taro; Ishida, Seiki (2006). "Wafer management between coat/Developer track and immersion lithography tool". In Flagello, Donis G. (ed.). Optical Microlithography XIX. Vol. 6154. pp. 1553–1562. doi:10.1117/12.656303. S2CID 110508653.
Ma, J. H.; Naulleau, P.; Ahmed, M.; Kostko, O. (2020). "Determination of effective attenuation length of slow electrons in polymer films". Journal of Applied Physics. 127 (24): 245301. Bibcode:2020JAP...127x5301M. doi:10.1063/5.0007163. OSTI 1782149. S2CID 221935438.
Pfeiffer, Hans C. (2010). Montgomery, M. Warren; Maurer, Wilhelm (eds.). "Direct write electron beam lithography: A historical overview". Photomask Technology 2010. 7823. Bibcode:2010SPIE.7823E..16P. doi:10.1117/12.868477. S2CID 108646584.

semiengineering.com

"DSA Re-Enters Litho Picture". March 15, 2018.
LaPedus, Mark (March 19, 2018). "EUV's New Problem Areas". Semiconductor Engineering.
"Manufacturing Bits: Feb. 5". 5 February 2019.

semiwiki.com

"Resist Development for High-NA EUV - Read more on SemiWiki". 25 February 2024.
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spie.org

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spiedigitallibrary.org

Clark, Benjamin L.; Kocsis, Michael; Greer, Michael; Grenville, Andrew; Saito, Takashi; Huli, Lior; Farrell, Richard; Hetzer, David; Hu, Shan; Matsumoto, Hiroie; Metz, Andrew; Kawakami, Shinchiro; Matsunaga, Koichi; Enomoto, Masashi; Lauerhaas, Jeffrey; Ratkovich, Anthony; Dekraker, David (2015). "Coater/Developer process integration of metal-oxide based photoresist". In Wallow, Thomas I.; Hohle, Christoph K. (eds.). Advances in Patterning Materials and Processes XXXII. Vol. 9425. pp. 355–361. doi:10.1117/12.2085982. S2CID 122169514.
Jamieson, Andrew; Dam, Thuc; Baik, Ki-Ho; Duerksen, Ken; Eidson, Elie; Akai, Keiji; Hisano, Kazuya; Kohama, Norifumi; Machidori, Shinichi (May 20, 2006). "The design and qualification of the TEL CLEAN TRACK ACT^TMM photomask coating tool at Intel". In Hoga, Morihisa (ed.). Photomask and Next-Generation Lithography Mask Technology XIII. Vol. 6283. SPIE. pp. 471–478. doi:10.1117/12.681751. S2CID 110358910 – via www.spiedigitallibrary.org.
Wei, Yayi; Brainard, Robert (February 19, 2009). "Process Steps in the Track". Advanced Processes for 193-nm Immersion Lithography. Vol. PM189. pp. 19–52. doi:10.1117/3.820233.ch2. ISBN 978-0-8194-7557-2 – via www.spiedigitallibrary.org.
Hiroi, Yoshiomi; Kishioka, Takahiro; Sakamoto, Rikimaru; Maruyama, Daisuke; Ohashi, Takuya; Ishida, Tomohisa; Kimura, Shigeo; Sakaida, Yasushi; Watanabe, Hisayuki (2007). "BARC (Bottom anti-reflective coating) for immersion process". In Lin, Qinghuang (ed.). Advances in Resist Materials and Processing Technology XXIV. Vol. 6519. pp. 731–740. doi:10.1117/12.711305. S2CID 122377285.
Wakamizu, Shinya; Kyouda, Hideharu; Nakano, Katsushi; Fujiwara, Tomoharu (2008). "193-nm immersion lithography for high volume manufacturing using novel immersion exposure tool and coater/Developer system". In Chen, Alek C.; Lin, Burn; Yen, Anthony (eds.). Lithography Asia 2008. Vol. 7140. pp. 819–826. doi:10.1117/12.804675. S2CID 109584069.
Fujiwara, Tomoharu; Shiraishi, Kenichi; Tanizaki, Hirokazu; Ishii, Yuuki; Kyoda, Hideharu; Yamamoto, Taro; Ishida, Seiki (2006). "Wafer management between coat/Developer track and immersion lithography tool". In Flagello, Donis G. (ed.). Optical Microlithography XIX. Vol. 6154. pp. 1553–1562. doi:10.1117/12.656303. S2CID 110508653.

stfc.ac.uk

U.K. Engineering & Physical Sciences Research Council / Lasers in Our Lives / 50 Years of Impact; "Archived copy" (PDF). Archived from the original (PDF) on 2011-09-13. Retrieved 2011-08-22.{{cite web}}: CS1 maint: archived copy as title (link)

udel.edu

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web.archive.org

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